Description
Silver heatsink compound thermal paste (1.0 gram) for CPU coolers. High thermal conductivity, low bleed and stable formula for thermal coupling of electrical devices to heatsinks.
- 1.0 gram silver thermal paste
- Thermal conductivity >1.93 W/m-k
- Thermal impedance <0.120°C-in2/W
- For CPU cooler use; thermal coupling of devices to heatsinks
